Education
- Brown University, Ph.D. 1986
- Brown University, M.S. 1983
- Brown University, B.S. 1981
Professional Experience
- Department of Mechanical Engineering, Stony Brook University,
87 - present
- Senior Fellow, National University of Singapore, 97-98
- Visiting Research Fellow: Tokyo Institute of Technology, 94-94
Research Interests and History
Toshio Nakamura's research area is in the computational stress and fracture
analysis of various materials and structures. His studies include the
detailed stress and failure investigation of multi-phase materials used
in electronic packaging, failure mechanisms of laminated structures,
and development of nonlinear constitutive equation of composite solids.
Recent research activities also cover the investigations of various
mechanical aspects of thermally sprayed coatings. Nakamura has organized
several fracture and FGM symposiums and is the Chair of Fracture and
Failure Committee (1999-01) in Applied Mechanics Division of ASME. He
was a senior participant of NSF MRSEC Center on Thermal Spray at Stony
Brook. Nakamura was a visiting research fellow at Tokyo Institute of
Technology for seven months in 1993, and spent six month as a senior
fellow at the National University of Singapore with the joint appoint
with the Institute of Material Research and Engineering in 1997. He
has received Ross Coffin Purdy Award from the American Ceramic Society
in 1992 and authored/co-authored over forty research articles in journals
and proceedings.
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