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Welcome ! |
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Computational Mechanics Laboratory of SUNY at Stony Brook focuses on computational stress and fracture analysis of various advanced materials and structures. The main research interest is the failure mechanisms of laminated structures, detailed stress and failure investigation of multi-phase materials used in electronic packaging, and development of nonlinear constitutive equation of composite solids. Recent research activities also cover the investigations of various mechanical aspects of thermally sprayed coatings. Please feel free to contact or even visit us. Any questions and suggestions are highly welcome.
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Thermo-mechanical analysis of solder bump and UBM of flip-chip package |
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Department of Mechanical Engineering Light Engineering Building, Room 006 State University of New York at Stony Brook STONY BROOK, NY 11794-2300 Tel: (631)632-4164, Fax: (631)632-8544 |
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Last updated , October 30, 2006 10:07 AM |
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